ELECTRONIC COOLING

 

 

Thermal management components are an important part of today’s electronic assemblies. Many solutions are available to control heat.
THERMAL MAX® MICRO Heat Exchanger

THERMAL MAX® MICRO

The THERMAL MAX® MICRO is a miniature water-to-air heat exchanger system that has an overall footprint of 6″ square. It is ideal to increase clock-speed and performance by dissipating unwanted heat from CPUs.

The THERMAL MAX® MICRO is a self-contained modular heat exchanger that utilizes a high performance 12-volt electric fan [24-volt optional] that can handle liquids up to 3 gpm and is capable of dissipating up to 1000 btu. per hour. Other compact sizes are available.

For more information, contact EFE at 800-338-4120.

 

 

 

 

THERMAL STAR®

The THERMAL STAR® helical air distribution system is a novel way to keep electronics cool by eliminating the need for a fan to be directly attached to such components. It is ideal to spot cool several different electronic parts using a single fan that is normally placed outside of an enclosure. In operation, the ambient air stream generated by the fan is discharged through helical slit openings placed about the components to be cooled. By attaching the fan intake directly to an air conditioning source, it can distribute a pressurized climate-controlled air stream only to the components that require cooling, thereby resulting in better thermal management control and efficiency.

For more information, contact EFE at 800-338-4120.